LG claims that Infineon’s Real3 image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ
LG Electronics announced that it has teamed up with Infineon Technologies in order to introduce Time-of-Flight (ToF) technology in smartphone cameras. The technology, as per the brand, will be loved by selfie enthusiasts. It is to be noted here that the brand is going through tough times in terms of smartphone sales in the world.
“Keeping in mind LG’s goal to provide real value to its mobile customers, our newest flagship was designed with ToF technology from inception to give users a unique and secure verification system without sacrificing camera capabilities,” said Chang Ma, senior vice president and head of product strategy at LG Mobile Communications Company.
He added, “The LG G8 ThinQ featuring ToF will be the optimal choice for users in search of a premium smartphone that offers unmatched camera capabilities.”
Use of Infineon’s Real3 image sensor chip
LG claims that Infineon’s Real3 image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ. The phone is set to be unveiled in Barcelona during the Mobile World Congress 2019.
The brand’s official statement read, “Building upon the combined expertise of Infineon and pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a smartphone.”
It added, “While other 3D technologies utilize complex algorithms to calculate an object’s distance from the camera lens, the ToF image sensor chip delivers more accurate measurements by capturing infrared light as it is reflected off the subject. As a result, ToF is faster and more effective in ambient light, reducing the workload on the application processor thereby also reducing power consumption.”
Andreas Urschitz, division president of Infineon’s power management and multimarket division, said, “We have demonstrated service beyond the mere product level – specifically catering to phone OEMs, associated reference design houses and camera module manufacturers. Within five years, we expect 3D cameras to be found in most smartphones and Infineon will contribute a significant share.”